Smart Manufacturing: Data Connectivity & Real-Time AI
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Smart Manufacturing: Data Connectivity & Real-Time AI

Discover how BL110, EdgePLC, EA Series, ARMxy, EdgeIO, and TPC enable smart manufacturing with data connectivity, edge AI, and real-time control.
Smart Manufacturing: Data Connectivity & Real-Time AI
Case Details
1.Equipment Connectivity and Protocol Unification

Factories run PLCs from Siemens, Mitsubishi, Omron, Delta, and others — alongside Modbus, BACnet, and IEC104. Without unified data, higher-level intelligence is impossible.

BL110 protocol conversion gateway solves this. It collects mainstream PLC protocols and industrial protocols downstream, then forwards to OPC UA, MQTT, or Modbus TCP upstream. It connects directly to Alibaba Cloud IoT, Huawei Cloud IoT, and ThingsBoard — without replacing existing equipment. This moves smart manufacturing maturity from Level 2 (Standardized) to Level 3 (Integrated).

2.Edge-Side Control and AI Convergence

If all data goes to the cloud and instructions come back, latency and bandwidth cannot support a truly intelligent line. Level 4 (Optimized) maturity requires AI inference at the edge.

EdgePLC integrates CODESYS real-time control (five IEC 61131-3 languages), EtherCAT, up to 6 TOPS AI compute, and up to 1024 I/O points in a single DIN-rail device. It supports natural-language-driven AI for predictive maintenance and anomaly diagnosis.

EA Series handles heavier edge AI inference:

  • EA150 (Rockchip RK3588): 6 TOPS, supports M.2 compute stick
  • EA230/Pro (Jetson Orin Nano): up to 67 TOPS
  • EA250/Pro (Jetson Orin NX): up to 157 TOPS, 4x GMSL2 cameras, 18-channel EA270 (Jetson AGX Orin): 275 TOPS, 4x SFP+ 10G fiber, 8x GMSL2 cameras

How they work together: EdgePLC handles the deterministic control loop at millisecond cycles and passes vibration, temperature, and current signals to the EA Series for AI inference. The EA Series runs visual inspection or equipment health models and feeds results back to EdgePLC via digital output or RS485. Control and intelligence close the loop at the edge — not on two separate systems.

3.Flexible, Scalable Field Architecture

Production lines must adapt quickly to product changeovers and capacity shifts. Hardware must be modular.

ARMxy Series uses a “main control platform + X board + Y board” architecture. Users swap Y boards (digital, analog, temperature, pulse, serial) to match field signals — no custom redesign. In a filling and capping machine upgrade, ARMxy (RK3562j) used an IgH EtherCAT master to synchronize conveyor servo, filling pump, and capping servo.

EdgeIO pushes flexibility to the I/O layer. BL192Pro integrates Modbus TCP, OPC UA, and MQTT in one device — replacing “PLC + I/O + protocol gateway + cloud gateway.” For legacy lines, it emulates original PLC address mapping so HMI remains compatible with zero changes, while adding OPC UA and MQTT cloud connectivity.

How Products Fill the Gaps

Smart Manufacturing Need

Capability Gap

Solution

Equipment connectivity

Multi-brand PLCs, multiple protocols

BL110 converts to OPC UA/MQTT

Real-time control + AI

PLCs lack AI; industrial PCs lack real-time

EdgePLC (CODESYS + 6 TOPS); EA Series up to 275 TOPS

Integrated HMI + edge computing

HMI, controller, compute are separate

TPC touch panel integrates HMI, CODESYS, AI inference, IP66

Flexible field I/O

Fixed interfaces; rewiring for changeovers

ARMxy X/Y boards; EdgeIO pluggable I/O

Low-cost legacy intelligence

Cannot replace PLC or modify HMI

EdgeIO emulates PLC addresses; adds OPC UA/MQTT

Conclusion

Smart manufacturing does not replace old systems. It overlays data connectivity and edge intelligence on existing assets.

  • BL110 solves “can it connect?”
  • EdgeIO and ARMxy solve “can it be controlled flexibly?”
  • EdgePLC solves “can it make real-time decisions?”
  • EA Series solves “can it perceive deeply?”
  • TPC solves “can humans and machines collaborate on one screen?”

Together, they form the complete path from digitalization to intelligence.

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